Published Paper Details:

The motivation for this thesis is the desire to overcome the problem associated with reliability and yield of these staggeringly small devices called MicroElecro Mechanical System (MEMS).The field of Microelectromechanical system involves the interaction of the physical environment with electrical signals through the use of micro batch fabricated devices. MEMS are an emerging technology which finds applications in diverse fields such as automotive medicine aeronautics communication and defense. The device dimensions range well into the micrometer regime and are soon approaching the length scales studied by nanotribologist though the MEMS technology has made a substantial impact over the past decade at the device or component level, it has yet to realize a wide range commercial success. Stiction, adhesion, friction and wear seem to be main deterrents to their lifetime, and hence full commercialization of these devices. These problems can be attributed to the high surface to volume ratio, substantial solid surface nano contacts, close proximity of microstructure and a myriad other device complications. Several researchers have come up with solutions to avoid release -related stiction, but in use stiction and friction still persist, proving detrimental to the life span of these microstructures. Though a variety of engineering solutions have been employed to solve them . In this study ,an attempt is made to remove stiction by sublimating the resin via low melting point liquid t-butyl alcohol. An experimental setup is developed such that the microstructure would be rinsed by t-butyl alcohol directly by sublimation, to maintain the temperature peltier chips are used as they are pretty small and available and create freezing temperature.